HSINCHU, Sept. 24, 2025 /PRNewswire/ — M31 Technology Corporation (M31), a leading silicon intellectual property (IP) provider, today announced its latest Ultra-Low Leakage (ULL), Extreme Low Leakage (ELL), and Low-VDD operation memory compilers at the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum.
Developed on TSMC’s advanced N6e platform, these compilers are optimized for ultra-low power consumption to meet the stringent requirements of AI-driven edge and IoT devices. Building on its proven low-power IP solutions for the TSMC N12eTM process, M31 expands its portfolio with the N6e platform, offering customized memory compilers leveraging LL, ULL, and ELL SRAM bit cells. These solutions are tailored for smart home, wearable, and other edge applications that demand an optimal balance between performance and minimal power consumption.
The ULL memory compilers for the TSMC N6e process offer high-density, high-performance SRAMs and high-performance One Port Register File, featuring redundancy, power gating, scan, built-in self-test (BIST) MUX, and wide-range dual-rail support enabling dynamic voltage and frequency scaling (DVFS). The high-sigma design methodology ensures robust operation under optimized margin conditions. M31’s ELL memory compilers on the TSMC N6e process further improve power efficiency, offering 50% power reduction in deep sleep mode, targeting designs with more stringent power and footprint constraints without compromising much on speed or customization flexibility. Low-VDD memory compilers could operate in 0.5V to provide extremely low power consumption, not only in dynamic power but also in leakage power. Together, these three types of memory compilers provide a versatile portfolio tailored to meet diverse design requirements across the TSMC N6e platform.
Additionally, M31 is deeply honored to receive the 2025 TSMC OIP Partner of the Year Award in the category of Specialty Process IP, marking its eighth consecutive year of earning this prestigious recognition. This consistent achievement underscores M31’s outstanding contributions and close collaboration within the TSMC Open Innovation Platform® (OIP) ecosystem, reinforcing its reputation as a trusted leader in silicon IP innovation. Scott Chang, M31 CEO, remarked, “M31’s long-standing partnership with TSMC is the cornerstone of our innovation. From the N12e Low-VDD solutions to the latest N6e ULL, ELL and Low-VDD memory compilers, we continue to deliver leading-edge IP that accelerates silicon success for AIoT and edge applications. We look forward to working even more closely with TSMC and the OIP ecosystem partners to drive the future of AI-powered technologies.”
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SOURCE M31 Technology
