Press Release
Category Added in a WPeMatico Campaign
-
Haut.AI Collaborates with OLAY on Virtual Companion Technology to Power Clinically Modeled Skincare Simulations
NEW YORK, June 10, 2026 /PRNewswire/ — Haut.AI today announced its collaboration with OLAY, a Procter & Gamble (P&G) brand,…
Read More » -
TeamSystem completes its $250 Million AI Investment Plan a year ahead of schedule: further acceleration expected by 2030
AI continues to see strong growth: a 25% increase in customer adoption and a 42% increase in revenue from AI…
Read More » -
MarketersMEDIA Newswire3 weeks ago
Control Logic Training Announces Summer and Fall Classes for ControlLogix 5000
The Allen Bradley ControlLogix 5000 training programs remain in high demand. Control Logic Training will come on-site for this training…
Read More » -
Asia Leads in Domestic Digital Payments but Lags in Cross-Border Payments: Saber Whitepaper
SAN FRANCISCO, June 10, 2026 /PRNewswire/ — Despite leading the world in domestic payment innovation, Asia’s cross-border payment corridors remain…
Read More » -
Acer Listed on 2026 Dow Jones Best-in-Class World Index
TAIPEI, June 10, 2026 /PRNewswire/ — Acer Inc. (TWSE: 2353) announced its inclusion in the 2026 Dow Jones Best-in-Class (DJBIC) World…
Read More » -
Lundbeck to present new patient data on neuroendocrine and neuroimmunology programs at ENDO 2026
Upcoming presentations at ENDO 2026 highlight Lundbeck’s Focused Innovator strategy and continued expansion into rare neuroendocrine diseases with high unmet…
Read More » -
ROHM Launches New Top-side Cooling Package for SiC MOSFETs, Combining High Heat Dissipation with High Voltage Support
KYOTO, Japan, June 10, 2026 /PRNewswire/ — ROHM Co., Ltd. has developed the TSC3PAK (14.00 x 18.58 x 3.50 mm)…
Read More » -
Pollo AI Launches Commerce Studio for Sellers: 3 Workflows Streamlining Product Visual Creation
SINGAPORE, June 10, 2026 /PRNewswire/ — Pollo AI today announced the launch of Commerce Studio, a new AI-powered workspace created…
Read More » -
ROHM Launches New Top-side Cooling Package for SiC MOSFETs, Combining High Heat Dissipation with High Voltage Support
KYOTO, Japan, June 10, 2026 /PRNewswire/ — ROHM Co., Ltd. has developed the TSC3PAK (14.00 x 18.58 x 3.50 mm)…
Read More » -
Binary News Network3 weeks agoAI STUDIOS Launches AI Course Builder: Turn Any Topic Into a Full Course
The new AI Course Builder feature inside AI STUDIOS auto-generates complete e-learning curricula — sections, lessons, and quizzes — from…
Read More »