Next-Generation Data Center Commissioning Technology to Validate CDUs, Liquid Systems, Thermal Loads, Telemetry, Control Systems, and Electrical Infrastructure Enabling Faster Deployment and Reduced Integration Risk for GPU Rack and AI Factory Evolution
BOCA RATON, Fla.–(BUSINESS WIRE)–#Boyd—Boyd, whose chip-to-ambient liquid cooling technologies make it easier for data center owners and operators to implement new AI infrastructure, announced it is presenting a new rack simulating and commissioning test technology for NVIDIA GB200 NVL72 racks at OCP 2025 to help AI factories deploy liquid cooled data centers faster, reduce integration risk, and improve time to market.
Join Boyd and NVIDIA as they present “Rack Emulator Design for Multigenerational IT Racks” at the 2025 OCP Global Summit on Wednesday October 15th from 3:50pm to 4:05 pm PST at SJCC Concourse Level 210CDGH as part of OCP’s Data Center Facility track.
“Boyd’s programmable Rack Emulator is designed to speed time to deployment for liquid cooled NVIDIA Blackwell GPUs and we’re excited to introduce it at OCP,” said Jerry Toth, Boyd Chief Technology Officer. “GPU rack evolution demands next generation commissioning technology. Boyd’s Rack Emulator delivers advanced simulation functionality and performance to meet the evolving needs of AI factories and advanced data centers.”
Boyd’s Rack Emulator emulates the pressure drop and heat dissipation of multigenerational GPU racks and AI servers. It uses automation to test coolant distribution units (CDUs) and the broader liquid cooling system to validate thermal performance before connecting to accelerated computing infrastructure, such as NVIDIA GB200 NVL72 racks. Precision hydraulic and thermal performance efficiently validates thermal loads, liquid flow to each rack, telemetry, control systems, and electrical infrastructure by simulating GPUs and AI racks.
The Boyd Rack Emulator is flexible to simulate any server rack and supports up to 250 kW in a rack-width format, with technology roadmap development to 500 kW. It easily connects to the liquid cooling system where capacity and pressure drop protocols are input, operating like a server rack. The Rack Emulator minimizes space required to do thermal load testing and simplifies server rack simulations. Request to see it in person at the 2025 OCP Global Summit at Boyd’s booth C18.
Boyd’s liquid cooling technologies and global service model enable end clients to meet thermal performance specifications in an easy-to-adopt modular design. All of Boyd’s thermal technologies are backed by a heritage of high quality, reliable performance earned through decades of liquid cooling design and manufacturing excellence from scalable, global operations.
About Boyd
Boyd is the trusted global innovator of sustainable solutions that make our customers’ products better, safer, faster, and more reliable. Our innovative engineered materials and thermal solutions advance our customers’ technology to maximize performance in the world’s most advanced data centers; enhance reliability and extend range for electric and autonomous vehicles; advance the accuracy of cutting-edge personal healthcare and diagnostic systems; enable performance-critical aircraft and security technologies; and accelerate innovation in next-generation electronics and human-machine-interface. Core to Boyd’s global manufacturing is a deep commitment to protecting the environment with sustainable, scalable, lean, strategically located regional operations that reduce waste and minimize carbon footprint. We empower our employees, develop their potential, and inspire them to do the right things with integrity and accountability to champion our customers’ success.
Visit us at www.boydcorp.com
Contacts
Media contact Amie Jeffries [email protected]
