Footprint has been reduced to approximately 53% of that of conventional products, will enable more compact inverter substrates
TOKYO–(BUSINESS WIRE)–Mitsubishi Electric Corporation (TOKYO: 6503) announced today that it has developed a new compact version of its DIPIPM power semiconductor modules specifically for use in consumer and industrial equipment such as packaged air conditioners and heat pump heating and hot water systems. The new Compact DIPIPM series of products comprises the PSS30SF1F6 (rated current 30A / rated voltage 600V) and the PSS50SF1F6 (rated current 50A / rated voltage 600V), and samples will begin shipping on September 22.
By utilizing reverse-conducting insulated-gate bipolar transistors (RC-IGBTs), the module’s footprint has been reduced to almost 53% of that of the company’s conventional Mini DIPIPM Ver.7 series of products, enabling more compact inverter substrates in packaged air conditioners and other applications. The new products will be exhibited at Power Conversion and Intelligent Motion (PCIM) Asia Shanghai 2025 in Shanghai, China, from September 24 to 26.
Power semiconductors are key devices that efficiently convert electricity from DC to AC, and demand for them has accordingly been rising in recent years. Power semiconductor modules for packaged air conditioners and heat pump heating and hot water systems are used in the power conversion equipment of inverters that control outdoor unit compressors and fans. Globally, the shift to inverters is gathering pace in order to achieve energy savings in air conditioning systems, contributing to the realization of a decarbonized society. In this context, there is a growing need for more compact outdoor packaged air conditioner and heat pump components, not only to improve performance but also to reduce their footprint, leading to demand for smaller components such as inverter substrates.
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