Boyd to Present and Exhibit at NVIDIA GTC D.C.
WASHINGTON–(BUSINESS WIRE)–#Boyd–Boyd, a member of the NVIDIA Partner Network, and leader in artificial intelligence liquid cooling systems, will exhibit at GTC D.C., taking place October 27 – 29, 2025. Visit Boyd at booth #328 to learn more about Boyd’s liquid cooling system innovations and to see the Project OMNICOOL liquid cooling demonstration.
Boyd will present “Architecting the Data Center Cooling Circuit From ‘Chip to Ambient™’” on October 28th. This technical session presents an innovative method to optimize energy consumption in artificial intelligence (AI) factories of the future per watt of compute, tailoring real-time power usage to AI factory output. The ‘Chip to Ambient™’ thermal circuit cools all AI information technology (IT) equipment and power delivery systems from the chip to final heat exchange outside the AI factory. The full technical and facility cooling systems are intelligently integrated for IT and power with communications between each thermal system element in an interconnected “liquid communication layer” to balance demand load and predictive load planning. Boyd’s Chip to Ambient™ thermal circuit aligns cooling performance with variable IT demand and maximizes energy efficiency and system reliability while minimizing capital cost and space.
“Boyd is honored to support NVIDIA and other AI development pioneers at NVIDIA GTC Washington, D.C. 2025,” said Shammy Khan, Boyd Chief Commercial Officer. “This is a valuable opportunity for industry innovators to accelerate next-generation AI compute system development. We’re helping AI leaders design liquid cooled solutions that enhance performance, uptime, and reliability for systems of today and tomorrow.”
Boyd experts will be on site to discuss and showcase the Project OMNICOOL liquid cooling demonstration, representing collaborative contribution to the ARPA-E Coolerchips Project, as well as how Boyd liquid cooling systems maximize the performance of NVIDIA-powered AI factories. Boyd’s coolant distribution units (CDUs), liquid cooling loops, and rack manifolds meet the quality, performance, and reliability requirements of the most demanding IT equipment. These solutions are backed by Boyd’s 40+ years of data center cooling experience, produced by high-capacity global manufacturing facilities, and supported by global service teams with regional availability in North America, Europe, and Asia Pacific.
Experts will also be available to discuss Boyd’s Rack Emulator, recently presented by experts from Boyd and NVIDIA on October 15th at the Open Compute Project Summit 2025. The Rack Emulator enables faster testing and validation of liquid systems prior to IT equipment installation and startup, safeguarding multimillion dollar investments.
About Boyd
Boyd is the trusted global innovator of sustainable solutions that make our customers’ products better, safer, faster, and more reliable. Our innovative engineered materials and thermal solutions advance our customers’ technology to maximize performance in the world’s most advanced data centers; enhance reliability and extend range for electric and autonomous vehicles; advance the accuracy of cutting-edge personal healthcare and diagnostic systems; enable performance-critical aircraft and security technologies; and accelerate innovation in next-generation electronics and human-machine-interface. Core to Boyd’s global manufacturing is a deep commitment to protecting the environment with sustainable, scalable, lean, strategically located regional operations that reduce waste and minimize carbon footprint. We empower our employees, develop their potential, and inspire them to do the right things with integrity and accountability to champion our customers’ success.
Visit us at www.boydcorp.com.
Contacts
Media Contact
Amie Jeffries
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